183 Degree No Clean Lead Solder Paste Sn63pb37 - Shenzhen Bbien Technology Co.,ltd

183 Degree No Clean Lead Solder Paste Sn63pb37

PRICE: contract price
Company:
Shenzhen Bbien Technology Co.,ltd
Contact Person:
Bill Nong
Phone:
86-755-36852840


Product Description
Product Details183 degree no clean BBIEN lead solder paste TL-01 Sn63Pb37Brief Description for Sn63Pb37 lead solder pasteBBIEN TL-01 Sn63Pb37 is a no-clean,Website:http://www.bbiensolder.com, air or nitrogen reflowable leaded solder paste specifically designed to provide maximum print characteristics and solderability on lead-free parts using leaded solder paste.Its excellent reflowing soldering result and bright soldering joints is highly appreciated by users. It is also belong to low temperature solder paste as its melting point is not high,just 183 degree Celsius.BBIEN TL-01 Sn63Pb37 has been designed for applications that require the ultimate activity with respect to difficult to solder to components and board surface metalizations. BBIEN TL-01 Sn63Pb37 is also capable of stencil printing after downtimes of up to 90 minutes with an effective first print down to 20 mils. BBIEN TL-01 Sn63Pb37 is a solder paste formula that maintains its activity and printing characteristics for up to 8 hours without any shear thinning.Feature of Sn63Pb37 lead solder paste1) Fine Feature Capability: High print deposit volumes and low volume variability down to 12 mil (0.30mm) circle feature sizes.2) Electrical Reliability: Exceeds the requirements of the IPC and Bellcore SIR electrical reliability tests.3) Suitable for fine pitch applications such as 0.5 mm (20mil) pitch Flip-Chip and 0201 assembly.4) Excellent response to pause performance, generating fewer defects due to start up.5) High print speed, up to 150 mm/sec (6 inch/sec)6) Excellent solderability on difficult to solder to components, i.e., PdAg7) High activity on all substrates,including OSPs8) Capable of 90-minute break times in printing9) Excellent printing characteristics to 0.4mm (16 mil) pitch with Type 3 powder10) High print speeds to 150 mm/sec (6in/sec)Stable tack over 8+ hours Stencil life: 8+ hours (process dependent)Scrap is reduced due to less paste dry out.Classified as ROL0 per J-STD-004B.Compliant to Bellcore GR-7Availability BBIEN TL-01 Sn63Pb37 leaded no solder paste no clean is commonly available in the Sn63Pb37 type 3 powder(25-45micron),type 4 mesh is recommended, but different powder particle size distributions type5,type6 and type7 solder paste are available for standard and fine pitch applications.Health and SafetyThis product, during handling or use, may be hazardous to your health or the environment. Read the Safety Data Sheet and warning label before using this product.Cleaning for Sn63Pb37 lead solder pasteLead solder paste Sn63Pb37 is a no-clean formula. The residues don’t need to be removed for typical applications. Although lead solder paste TL-01Sn63Pb37 is designed for no-clean applications, its residues can be easily removed using automated cleaning equipment (in-line orbatch) with a variety of readily available cleaning agents. Call Kester Technical Support for details.Storage, Handling, and Shelf Life:Refrigeration is the recommended optimum storage condition for solder paste to maintain consistent viscosity,reflow characteristics and overall performance. HM531 should be stabilized at room temperature prior to printing. It should be kept at standard refrigeration conditions, 0-10°C (32-50°F). Please contact us if you require additional advice with regard storage and handling of this material. Shelf life is 6 months from date of manufacture when handled properly and held at 0-10°C (32-50°F).PackagingBBIEN TL-01 Sn63Pb37 Pb solder paste is currently available in 500g jars or 50g jar,100g tube,jet/syringe/cartridges packaging for enclosed print head systems is also readily available. Alternate packaging options may be available upon request.Out packing carton size:36*28*750px,N.W 10kgProduction Capacity: more than 2tons per weekApplicationBBIEN Sn63Pb37 lead solder pastes are used in the assembly of printed circuit boards (PCBs) and SMT for a wide variety of applications, including hand-held electronic devices such as smart phones and tablets, computer motherboards, consumer electronic products, network servers, automotive systems, medical and military equipment and many others. Exported countries:Brazil,India,UAE,America,Saudi-Ara,Pakistan,Iran,Egype,TurkeyPayment is flexible,T/T,western union,paypal,L/C at sightTechnical DatasheetBBIEN TL-01 Sn63Pb37 solder paste sizeMicroprint's small particle size of 5-45µm(-450+600 mesh),guarantees repeatable print definition to below 0.3mm forµBga workApplication CharacteristicsIPC ALLOY POWDER TYPEAlloy powder sizeAlloy powder contentMixture fluxStandard Printing325~45μm89~11%Fine pitch printing420~38μm88.5~11%Fine pitch printing515~25μm89~11%Ultrafine pitch printing610~18μm90%Ultrafine pitch printing75-12μm85-90~15%SortChemical composition(wt.%)SnPbInAgCuAuAlZnFeBiNiCdAsSbSn63Pb3762~6436~38
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