High Temperature Solder Paste Sacx0307 - Shenzhen Bbien Technology Co.,ltd

High Temperature Solder Paste Sacx0307

PRICE: contract price
Shenzhen Bbien Technology Co.,ltd
Contact Person:
Bill Nong

Product Description
Product DetailsBrief Description for LF-02 SACX0307 solder pasteSolder paste is prepared by kneading solder powder and solder flux and is used for surface mounting PC boards. BBIEN’S solder paste is a combination of solder powder without oxidation in a uniform particle size and flux with excellent chemical stability.BBIEN's Sn99Ag0.3Cu0.7 solder paste is a no-clean tacky soldering flux formula that possesses a high activity level,Website:http://www.bbiensolder.com, allowing it to solder nickel surfaces. The robust wetting action of this solder paste  will allow OSP treated copper, as well as heavily oxidized copper, surfaces to exhibit good soldering properties, even after 2 or 3 thermal cycles. Following reflow, SAC0307 will leave aesthetically pleasing clear residues on the assembly. Sn99Ag0.3Cu0.7 is designed for a high range of temperature and humidity conditions. Flow Chart for Quality Guarantee:Material Inspection ( a. Our QA Department   b. National Certification Department Note: Major material ) →Flux character Inspection→ Process products → Solder Paste Inspection → Solder Paste Package Inspection → Finished Products Inspection → Shipment Choice Inspection .Physical Properties(Data given for Sn99Ag0.3Cu0.7, 90% metal, -325+500 mesh)Data representative for most SnAgCu compositionsStandard Applications(For stencil printing)88.0% metal for -325+500 mesh87.5% metals for -400+500 meshViscosity (typical)1500 poise (-325+500 mesh)1550 poise (-400+500 mesh)Malcom viscometer @ 10rpm and 25°CInitial Tackiness (typical) 27 gramsTested to J-STD-005, IPC-TM-650, Method 2.4.44Slump Test PassTested to J-STD-005, IPC-TM-650, Method 2.4.35Solder Ball TestPreferredTested to J-STD-005, IPC-TM-650, Method 2.4.43Wetting Test: PassTested to J-STD-005, IPC-TM-650, Method 2.4.45Copper Mirror CorrosionLowTested to J-STD-004, IPC-TM-650, Method 2.3.32Corrosion TestLowTested to J-STD-004, IPC-TM-650, Method 2.6.15ApplicationBBIEN SAC0307 high temperature lead free solder paste is ideal used for precious computer motherboard, phone motherboard, printed circuit board (PCB), LED and SMT technique,as well as high-precision electronics circuit board. solder paste,PackingThe SAC0307 high temperature lead free solder paste could be classified as can/bottle packing and syringe packing type.Each can/bottle holds the solder cream is 500g;Each syringe can load the solder cream is 100gThe packing materials can be separated into inner layer of a bubble box and outer package of a paper carton so as to better secure for shipping and transportation.Size of carton:36*28*750px hold with net weight of 10kgCleaningLF-02 SACX0307 solder paste is a no-clean formula lead free solder paste.The residues do not need to be removed for typical applications. AlthoughLF-02 SACX0307 solder paste is designed for no-clean applications, its residues can be easily removed using automated cleaning equipment (in-line or batch) with a variety of readily available cleaning agents.Avalable typesBBIEN solder factory can supply many types of LF-02 SACX0307 no clean solder paste,standers paste composition size as following formular:Pitch printingIPC no.Metal alloy powder sizePowder contentRegular pitch printingType325~45 μm89 %Regular printingType420~38 μm88.5 %Fine pitch printingType515~25μm85 %Ultrafine pitch printingType610~18μm88.5 %Ultrafine pitch printingType72~12μm88.5 %Products PhotosTechnical DatasheetTechnical of hgh temperature solder paste LF-02 SACX0307The recommended reflow profile for LF-02 SACX0307 no clean solder paste made with the SAC allous is shown here. This profile is simply a guideline.Specification and chemistry componentItem name Chemical composition (wt.%)SnPbSbCuBiAgFeAlCdSn99Ag0.3Cu0.7Bal.< 0.10
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