Mobile Phone Motherboard Bga Rework Station Zm-r6000 - Seamark Zm

Mobile Phone Motherboard Bga Rework Station Zm-r6000

PRICE: 1999 USD
Company:
Seamark Zm
Contact Person:
lilybga li
Phone:
18823201735


Product Description

Main features                                                  

  • Large area of infrared carbon fiber Pre-heating system, with the advantage of pre-heating fast and evenly and no light pollution.
  • Temperature parameters protected by limits of authority, for avoiding error settings.
  • Ten segments of temperature control process, suitable for all kinds of BGA Rework.
  • Unlimited storage of the temperature profile, just need press one key to use the profile.
  • Three K-type sensors available can realize the high precise temperature testing of each point of PCB or BGA, and PC can generate report of curves analysis automatically.
  • Desoldering and soldering automatically, No need the manual adjustment
  • Hot air flow can be adjustable to meet the demand of any chips
  • USB Connection driver-free, PC control
  • The bottom hot air lifting control available in the front panel, it is convenient to adjust at any time.
  • Laser positioning available, to make the positioning faster.

 

Main technical parameter                                         

AC 220V   50/60 Hz

                 Max 4100W

800 W

800 W

2400W

400℃(Max)

400mm×300mm

                 395mm×375mm

2×2mm--60×60mm

L530×W520×H620

USB

3pcs

About 27.5kg

White

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